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BERGQUIST

BERGQUIST

GAP PAD TGP 3000

  • Thermal conductivity: 3.0 W/m-K
  • Low "S-Class" thermal resistance at very low pressures
  • Highly conformable,"S-Class" softness
  • Designed for low-stress applications
  • Fiberglass reinforced for puncture, shear and tear resistance

Tuotekuvaus

BERGQUIST® GAP PAD® TGP 3000 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. BERGQUIST GAP PAD TGP 3000 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

 

BERGQUIST GAP PAD TGP 3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The material’s natural inherent tack allows for stick-in-place characteristics during assembly. BERGQUIST GAP PAD TGP 3000 is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.

 

Options and Configurations

Standard sheet size - 8" x 16" or custom configuration
Standard thickness available - 0.010", 0.015", 0.020", 0.040", 0.060", 0.080", 0.100", 0.125"

Tuote

GAP PAD TGP 3000

GAP PAD TGP 3000
BERGQUIST GAP PAD TGP 3000, Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material

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